Wet Bench Systems
Engineered, Manufactured, and Supported in the USA
The Flexibench product line by Golden Fab is a modular, high-performance wet bench solution designed for 150mm , 200mm, and 300 mm silicon wafer processing. Engineered for semiconductor manufacturing, the Flexibench Models offer a suite of process modules, automation options, and configurable controls. Catering to university labs, R&D facilities, and production environments. With flexible configurations (manual, semi-automated, and fully-automated), advanced safety features, and cleanroom compatibility, Flexibench wet bench models deliver precision and scalability for all your wafer processing needs.
Product Highlights
Modular Design: Choose from a range of process modules, automation, and control solutions for tailored workflows. Customize the footprint to fit your fab space available
Material Compatibility: Fabricated with chemically compatible materials including, FM4910-rated CRP-1, Polypropylene, PVC, PVDF, Teflon, Stainless Steel, and flame-polished Quartz.
Enhanced Safety: Safety Interlocks and EMO Controller: Equipped with all relevant safety interlocks and an Emergency Machine Off (EMO) controller for immediate shutdown in critical situations, ensuring operator safety and compliance
Cleanroom Compatibility: Compact footprint meets Class 100 cleanroom standards, ideal for semiconductor environments
Scalability: Supports small-batch R&D to production-level wafer throughput
HMI/PLC Control System: A user-friendly touchscreen interface with integrated controls, recipe management, and alarms for real-time monitoring
Exhaust System: Designed for adequate exhaust flow with continuous monitoring to ensure a safe working environment, meeting SEMI S2 ventilation requirements
Certifications: All safety-critical components (breakers, fuses, isolation devices, and live-side components before the secondary) are UL Listed an CSA certified
Silicon Wafer Process Modules Supported
Piranha Etch: Controls sulfuric acid-hydrogen peroxide mix (3:1 to 7:1), 130–140°C, with agitation and peroxide spiking
KOH Etch: Manages KOH (20–40 wt%), 50–80°C, with adjustable etch rates for anisotropic silicon etching.
Buffered Oxide Etch (BOE): Regulates buffered HF (6:1 to 10:1), 10–60°C, for precise SiO2 etching.
Silicon Nitride Etch: Oversees hot phosphoric acid (85% H3PO4), 160–180°C, with water spiking control.
RCA Clean (SC1 & SC2): Automates NH4OH:H2O2:H2O and HCl:H2O2:H2O mixes, 70–80°C, for two-step cleaning.
HF Etch: Controls dilute HF (1–10%), ambient to 40°C, for SiO2 etching and cleaning.
Metal Etch: Manages aqua regia or phosphoric-acetic-nitric blends, 25–60°C, for selective metal removal.
Solvent Clean: Regulates acetone, IPA, or NMP, ambient to 60°C, for organic residue removal
QDR (Quick Dump Rinser): A rapid rinse module using deionized water to remove chemical residues after etching or cleaning processes. It includes adjustable flow and timing to optimize rinsing efficiency, making it a critical step in wafer preparation.
N2 or IPA Vapor Dryer: A drying module using heated nitrogen or isopropyl alcohol (IPA) vapor to ensure spot-free, dry wafers post-rinse or cleaning, enhancing surface quality for subsequent steps.